Thermal control arrangement for a data processing system
US8662943B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 5, 2006 |
| Grant date | Mar 4, 2014 |
| Priority date | — |
| Expiry date | Jan 8, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02D10/00
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Exemplary embodiments of methods and apparatuses to provide a cooling arrangement for a system are described. The system includes a component coupled to a heat sink. A signal associated with a temperature control of the component is asserted. A target temperature of the heat sink is adjusted based on the signal. In one embodiment, a temperature control loop of the heat sink is operated. The temperature of the heat sink may be monitored using one or more sensors placed on the heat sink. An operation of the component, a cooling unit coupled to the heat sink, or both, may be adjusted based on a relationship between the temperature of the heat sink and an adjusted target temperature. Adjusting the target temperature of the heat sink based on the asserted signal increases efficiency of the system while decreasing cooling.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.