Hydrogel bone void filler
US8663225B2 · kind B2 · utility
0Cited by
65References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 12, 2004 |
| Grant date | Mar 4, 2014 |
| Priority date | — |
| Expiry date | Jan 27, 2030 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61L27/52
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A bone void filler material, including a hydrogel component provided by microparticulates of pre-set hydrogel material dispersed within a carrier component to maintain the microparticulates substantially proximate to one another so that the resulting fill material is rendered as a substantially flowable mass.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.