Heat treatment method and components treated according to the method
US8663404B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 8, 2007 |
| Grant date | Mar 4, 2014 |
| Priority date | — |
| Expiry date | Jul 18, 2027 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF01D5/02
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Disclosed herein is a method of treating a component comprising solution treating the component for a period of about 4 to about 10 hours at a temperature of about 1750 to about 1850°F.; cooling the component to a temperature of about 1580 to about 1650°F. at an average rate of 1°F./min to about 25°F./min; stabilizing the component at about 1580 to about 1650°F. for a period of about 1 to about 10 hours; cooling the component to room temperature; precipitation aging the component at a first precipitation aging temperature of about 1275 to about 1375°F. for about 3 to about 15 hours; cooling the component at an average rate of 50 to about 150°F./hour to a second precipitation aging temperature of about 1100 to about 1200°F. for a time period of about 2 to about 15 hours; and cooling the component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.