Heat transfer methods and sheets for applying an image to a substrate
US8663416B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 9, 2010 |
| Grant date | Mar 4, 2014 |
| Priority date | — |
| Expiry date | Jun 9, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1082
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
Methods of transferring an image to a substrate are generally provided. A heat transfer material can be partially cut to define a shape with cuts made into the heat transfer material (i.e., into its thickness). The heat transfer material includes a transferable portion overlying a release layer overlying a base sheet such that the cuts are made into the heat transfer material through the transferable portion while leaving the release layer and base sheet uncut. The transferable portion of the heat transfer material can be removed from the base sheet in an area surrounding the shape. Then, the heat transfer material can be positioned adjacent the substrate such that the transferable portion defined by the shape contacts the substrate. Heat and pressure can be applied to the heat transfer material. Thereafter, the base sheet can be removed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.