Semiconductor wafer handler
US8663490B2 · kind B2 · utility
0Cited by
16References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 21, 2011 |
| Grant date | Mar 4, 2014 |
| Priority date | — |
| Expiry date | Feb 21, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6838
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A semiconductor wafer handler comprises a ring (70) attached to a hub (80) by a plurality of spokes (90). Vacuum is applied to the surface of the semiconductor wafer through orifices (100) containing in the ring (70). Water and/or nitrogen can be applied to the surface of the semiconductor wafer through orifices (110) contained in the spokes (90).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.