Injection molding apparatus and method
US8663537B2 · kind B2 · utility
3Cited by
17References
34Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 18, 2012 |
| Grant date | Mar 4, 2014 |
| Priority date | — |
| Expiry date | Sep 22, 2032 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C2045/7393
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A heatsink for use in injection molding, with at least one load-bearing path with a rearward segment, wherein at least a portion of at least one non-load-bearing, dynamic heat-transfer zone of the heatsink is laterally offset from the rearward segment of the load-bearing path.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.