Patent · US Active

Manufacturing method for LED package

US8664018B2 · kind B2 · utility

0Cited by

9References

12Claims

0Family size

Assignee

ADVANCED OPTOELECTRONIC TECHNOLOGY, INC. · TW

Inventors

HSIN-CHIANG LIN · Cambridge, US
Wen-Liang Tseng · Hsinchu, TW
Chieh Chang · Cedar Park, US

Key dates

Filing date	Nov 7, 2011
Grant date	Mar 4, 2014
Priority date	—
Expiry date	Jan 18, 2032

Classification

Technology area (CPC H)Electricity
CPC primaryH10H20/0361

Abstract

The disclosure provides a manufacturing method for an LED package. A first luminescent conversion layer comprising one first luminescent conversion element is located on an LED chip, wherein the first luminescent conversion element is precipitated via centrifugation around the LED chip without sheltering the LED chip. Thereafter, a second luminescent conversion layer is located on the first luminescent conversion layer. The second luminescent layer has a second luminescent conversion element which has an excited efficiency lower that that of the first luminescent conversion element.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.