Reactive hot melt adhesive with improved hydrolysis resistance
US8664330B2 · kind B2 · utility
1Cited by
12References
10Claims
0Family size
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Key dates
| Filing date | Apr 4, 2003 |
| Grant date | Mar 4, 2014 |
| Priority date | — |
| Expiry date | Oct 11, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31551
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
High green strength reactive hot melt adhesives are prepared using relatively low levels of reactive acrylic, and may be prepared with liquid crystalline or crystalline diols.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.