Modified 0402 footprint for a printed circuit board (‘PCB’)
US8664541B2 · kind B2 · utility
1Cited by
14References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 25, 2011 |
| Grant date | Mar 4, 2014 |
| Priority date | — |
| Expiry date | Nov 18, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/094
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A modified 0402 footprint for a PCB, including: at least two padstacks each having a minimum area consistent with the 0402 standard; and each padstack modified on at least two corners such that the padstack's footprint can be placed beneath a ball grid array (‘BGA’), the BGA having approximately a 1 millimeter pitch, and such that the padstack may be placed at least at a minimum distance away from a closest via in the PCB, wherein each padstack has a trace to a via not directly under a padstack in the PCB and each padstack has no via within the padstack.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.