Patent · US Active

Reconstituted wafer package with high voltage discrete active dice and integrated field plate for high temperature leakage current stability

US8664756B2 · kind B2 · utility

10Cited by

10References

19Claims

0Family size

Assignee

Medtronic, Inc. · US

Inventors

Mark R. Boone · Gilbert, US
Mohsen Askarinya · Chandler, US
Larry E. Tyler · Mesa, US

Key dates

Filing date	Jul 24, 2012
Grant date	Mar 4, 2014
Priority date	—
Expiry date	Jul 24, 2032

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/13091
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A reconstituted wafer level package for a versatile high-voltage capable component is disclosed. The reconstituted wafer package includes a dice substantially encapsulated by a mold material except for a first face. A dielectric layer is disposed on the first face of the dice. The package further includes an array of ball bumps formed on an exterior facing portion of the dielectric layer. Further, a field plate is disposed within the dielectric material and interposed between the first face of the dice and the ball bump array. The field plate may be spaced from the dice by a predetermined distance to prevent dielectric breakdown of the material of the dielectric layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.