Patent · US Active

Chip carrier for a transponder module and transponder module

US8665172B2 · kind B2 · utility

1Cited by

4References

5Claims

0Family size

Assignee

SMARTRAC I.P. B.V. · NL

Inventors

Manfred Rietzler · Marktoberdorf, DE
Raymond Freeman · Mesa, US

Key dates

Filing date	Mar 20, 2009
Grant date	Mar 4, 2014
Priority date	—
Expiry date	Jun 30, 2030

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

A chip carrier for contacting with a chip and an antenna is disposed on an antenna substrate. The chip carrier features a carrier substrate having a chip contact arrangement located at a distance from longitudinal ends of the carrier substrate for electrical contacting with a chip. The carrier substrate includes two antenna contact surfaces having the chip contact arrangement therebetween for electrical contacting with the antenna. The chip contact arrangement and the antenna contact surfaces are located on an application surface of the chip carrier. At least one insulation surface-is formed on the application surface between the chip contact arrangement and the antenna contact surfaces.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.