Systems and methods to thermally manage electronic devices
US8665591B2 · kind B2 · utility
7Cited by
5References
31Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 21, 2010 |
| Grant date | Mar 4, 2014 |
| Priority date | — |
| Expiry date | Feb 23, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E60/10
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A system for an electronic device includes a housing having one or more walls that define an internal region. An outlet port is fluidically coupled to the internal region of the housing, which allows emission of a fluid from the internal region of the housing as a first flow at a first temperature. A merging element, fluidically coupled to the outlet port, merges the first flow with a second flow, which has a second temperature that is less than the first temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.