Patent · US Active

Method and apparatus for forming a layered metal structure with an anodized surface

US8667661B2 · kind B2 · utility

4Cited by
34References
19Claims
0Family size

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Key dates

Filing dateDec 20, 2012
Grant dateMar 11, 2014
Priority date
Expiry dateDec 20, 2032

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T428/12757
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

Methods and apparatus for forming a multi-layered metal structure that includes an anodized surface are disclosed. According to one aspect, a housing arrangement can include a stainless steel layer and at least a first layer. The first layer can have a first bonding surface and a first exterior surface. The first bonding surface can be substantially bonded in direct contact with the stainless steel layer, and the first exterior surface can be an exterior of the housing arrangement. The first exterior surface is an anodized surface. In one embodiment, the first layer can be formed from an anodizable material such as aluminum, titanium, niobium, or tantalum.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.