Radiation curable adhesive
US8669301B2 · kind B2 · utility
1Cited by
0References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 22, 2009 |
| Grant date | Mar 11, 2014 |
| Priority date | — |
| Expiry date | Jan 28, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31551
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to urethane(meth)acrylate resins obtained from the reaction, in a first step, of at least one polyisocyanate (I) with at least one compound (II) containing at least two reactive groups capable to react with isocyanate groups and at least one (meth)acrylate (III) containing essentially one reactive group capable to react with isocyanate groups, and, in a subsequent step, reacting the product obtained from the first step with at least one polyisocyanate (IV) different from the poly-isocyanate (I) used in the first step, and their use for making radiation cured pressure sensitive adhesives.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.