Method and device for routing over a void for high speed signal routing in electronic systems
US8669830B2 · kind B2 · utility
1Cited by
1References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 14, 2011 |
| Grant date | Mar 11, 2014 |
| Priority date | — |
| Expiry date | Mar 3, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09727
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments of the present invention are directed to providing an increased trace width when traversing a void in another layer in a printed circuit board or package design. By increasing the trace width or alternatively increasing the capacitance, the degradation due to the void can be reduced. This approach works for microstrip, stripline as well as other transmission lines that use a reference plane. The void can be the result of an antipad associated with a via, or any other disruption in an otherwise uniform reference plane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.