Heat pump
US8671706B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 29, 2010 |
| Grant date | Mar 18, 2014 |
| Priority date | — |
| Expiry date | Nov 15, 2032 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF25B2600/0251
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat pump according to the present invention comprises a plurality of the compression chambers, and compresses refrigerant with multistage, and injects vapor refrigerant into the space between the plurality of the compression chambers by using the first refrigerant injection flow path and the second refrigerant injection flow path. Performance and efficiency of the heat pump can be improved compared with non-injection, as flow rate of the refrigerant circulating the indoor heat exchanger is increased. Thus heating performance can be improved also in the extremely cold environmental condition such as the cold area by increasing the injection flow rate. Also, because the heat pump according to the present invention comprises the first refrigerant injection flow path and the second refrigerant injection flow path, refrigerant is injected twice. Thus, as the injection flow rate of the refrigerant is increased, heating capacity can be improved. Also, the difference between the suction pressure and the discharge pressure of the rotary compressor may be decreased, and thus the reliability and the performance of the rotary compressor can be improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.