Combination card of metal and plastic
US8672232B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 27, 2011 |
| Grant date | Mar 18, 2014 |
| Priority date | — |
| Expiry date | Jun 27, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31699
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A card formed in accordance with the invention includes a first assembly comprised of multiple plastic layers attached via an adhesive to a metal layer. The multiple plastic layers forming the first assembly are laminated under a first selected temperature and pressure conditions to preshrink the multiple plastic layers, stress relieve the first assembly and render the first assembly dimensionally stable. The laminated first assembly is then attached to a metal layer via an adhesive layer to form a second assembly which is then laminated at a temperature below the first selected temperature to form a card which is not subjected to warpage and delamination.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.