Curable epoxy resin-based adhesive compositions

US8673108B2 · kind B2 · utility

Assignee

• Henkel AG & Co. KGaA · DE

Inventors

• Jeng-Li Liang · Tuscaloosa, US
• Rajat K. Agarawal · Mülheim an der Ruhr, DE
• Gregory A. Ferguson · New Bedford, US
• Olaf Lammerschop · Krefeld, DE
• Frank Dittrich · Sinsheim, DE
• Rainer Schoenfeld · Goldkronach, DE

Key dates

• Filing date: Feb 2, 2009
• Grant date: Mar 18, 2014
• Expiry date: Mar 3, 2030

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C08L2666/14
• WIPO field: Basic materials chemistry
• WIPO sector: Chemistry

Abstract

This invention relates to compositions useful as adhesives and more particularly to the preparation of epoxy-based adhesive composition with improved impact resistance and good adhesion to oily metal substrates.