Method for producing silicon fine particles and method for controlling particle diameter of silicon fine particles
US8673168B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 9, 2011 |
| Grant date | Mar 18, 2014 |
| Priority date | — |
| Expiry date | Sep 9, 2031 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC01B33/037
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
An object and project of the present invention is to provide a method for producing silicon fine particles and a method for controlling a particle diameter of silicon fine particles which enable efficient production of silicon fine particles having a uniform particle diameter. A the characteristics of the present invention is producing silicon fine particles having a smaller particle diameter than silicon particles and controlling a particle diameter of silicon fine particles by immersing the silicon particles into an etching solution and irradiating the silicon particles immersed in the etching solution with light having a larger energy than a band gap energy of the silicon particles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.