Method for forming a connector for an implantable medical device
US8673194B2 · kind B2 · utility
5Cited by
25References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 5, 2008 |
| Grant date | Mar 18, 2014 |
| Priority date | — |
| Expiry date | Feb 27, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49016
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A connector assembly for an implantable medical device with hardware components placed in established physical locations within the polymer of the connector, and a method of making the assembly. One embodiment includes a method that involves forming a first shot, coupling at least one hardware component to the first shot to form a subassembly, placing the subassembly between a set of opposing areas of a mold, moving at least one of the areas of the set of opposed areas of the mold to constrain the subassembly within the mold, and introducing a second shot over at least a portion of the subassembly to form the connector.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.