Reflow method for lead-free solder
US8673761B2 · kind B2 · utility
0Cited by
2References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 19, 2011 |
| Grant date | Mar 18, 2014 |
| Priority date | — |
| Expiry date | Jan 7, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/16225
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A reflow method for solder includes heating the solder to a first temperature that is above a liquidus temperature of the solder; cooling the solder to a second temperature that is below a solidification temperature of the solder; reheating the solder to a third temperature that is above a solidus temperature of the solder and below the liquidus temperature of the solder; cooling the solder to a fourth temperature that is below the solidification temperature of the solder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.