Image sensor with reduced optical crosstalk
US8674283B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Dec 21, 2011 |
| Grant date | Mar 18, 2014 |
| Priority date | — |
| Expiry date | Oct 10, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/807
Abstract
A method of fabricating an image sensor includes the steps of: forming at least two photosites in a semiconductor substrate; forming a trench between the photosites; forming a thin liner on at least the sidewalls of the trench; depositing a conductive material having a first refractive index in the trench; and forming a region surrounded by the conductive material and having a second refractive index lower than the first index of refraction within the conductive material in the trench.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.