Interconnect structure with cavity having one or several contact rises on the wall of the cavity and method for producing same
US8674489B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 26, 2010 |
| Grant date | Mar 18, 2014 |
| Priority date | — |
| Expiry date | Dec 6, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49204
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An interconnect device is disclosed including a support in which at least one hole is formed, the hole having walls forming a closed contour and being formed by a cavity and one or several slots communicating with the cavity. The slots extend in a direction making a non-zero angle with the main plane of the support. Several conducting elements are positioned on at least one wall of the hole and pass through the hole. The conducting elements are each intended to connect conducting areas to each other that are situated on either side of the support. At least one of the slots separates two of the conducting elements from each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.