Antenna using through-silicon via
US8674883B2 · kind B2 · utility
1Cited by
38References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 24, 2011 |
| Grant date | Mar 18, 2014 |
| Priority date | — |
| Expiry date | Jun 13, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49016
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
An antenna includes a substrate and a top plate disposed over the substrate. At least one feed line is connected to the top plate, and each feed line comprises a first through-silicon via (TSV) structure passing through the substrate. At least one ground line is connected to the top plate, and each ground line comprises a second TSV structure passing through the substrate. The top plate is electrically conductive, and the at least one feed line is arranged to carry a radio frequency signal. The at least one ground line is arranged to be coupled to a ground.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.