Interleaved conductor structure with wrap around traces
US8675311B2 · kind B2 · utility
3Cited by
21References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 22, 2010 |
| Grant date | Mar 18, 2014 |
| Priority date | — |
| Expiry date | Oct 28, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B5/486
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An interleaved conductor structure for electrically connecting the read/write electronics to a read/write head in a hard disk drive is provided. The interleaved conductor structure may allow for an increased characteristic-impedance range, greater interference shielding and a reduction of signal loss that is contributed by a lossy conductive substrate. The electrical traces may have different widths, be offset, or even wrap around each other at the via connections.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.