Power module and power conversion device
US8675364B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 16, 2010 |
| Grant date | Mar 18, 2014 |
| Priority date | — |
| Expiry date | Sep 11, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02T10/7072
- WIPO fieldTransport
- WIPO sectorMechanical engineering
Abstract
A power module according to the present invention includes: a semiconductor element for converting DC current to AC current by switching operation; an electrical wiring board to which the semiconductor element is electrically connected, with the semiconductor element being disposed upon one of its principal surfaces; an insulating resin layer provided on the other principal surface of the electrical wiring board; a first insulation layer that is disposed opposite from the electrical wiring board, separated by the insulating resin layer, and that is joined to the insulating resin layer; a second insulation layer that is disposed opposite from the insulating resin layer, separated by the first insulation layer, and that ensures electrical insulation of the semiconductor element; and a metallic heat dissipation member that is disposed opposite from the first insulation layer, separated by the second insulation layer, and that radiates heat generated by the semiconductor element via the electrical wiring board, the insulating resin layer, the first insulation layer, and the second insulation layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.