Encapsulation of high definition audio data over an input/output interconnect
US8676362B2 · kind B2 · utility
16Cited by
2References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 11, 2007 |
| Grant date | Mar 18, 2014 |
| Priority date | — |
| Expiry date | Oct 30, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F3/162
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Embodiments of the invention are generally directed to systems, methods, and apparatuses for encapsulation of high definition audio data over an input/output interconnect. In some embodiments, a system includes tunneling logic coupled with a high definition (HD) audio controller. The tunneling logic may receive digital audio data from the HD audio controller, encapsulate the digital audio data in a message suitable for an in-band input/output (IO) interconnect, and send the message to an add-in graphics card via the in-band input/output IO interconnect. Other embodiments are described and claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.