Method for embedding electrical components
US8677615B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 8, 2011 |
| Grant date | Mar 25, 2014 |
| Priority date | — |
| Expiry date | Jul 8, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49146
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for embedding at least one component into a dielectric layer. obtain a good result, it is provided that the method includes the following steps: a) Position and affix the at least one component on a carrier; b) Cast a liquid dielectric around the at least one component, thereby enclosing the at least one component completely; c) Harden the liquid dielectric to form a solid dielectric layer; and d) Apply, in particular by lamination thereon, another layer, in particular an electrically conductive layer. The use of a dielectric layer formed entirely of liquid dielectric, wherein the liquid dielectric is not converted into a solid state until the dielectric is processed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.