Bundled wire guide apparatus for carrier and telecommunication module assembly
US8678855B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 20, 2011 |
| Grant date | Mar 25, 2014 |
| Priority date | — |
| Expiry date | Jan 28, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04Q1/149
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A bundled wire guide is insertable within an interior portion of a carrier/telecommunication module assembly. The bundled wire guide includes at least one channel configured to receive and guide at least a first wire bundle such that the at least one channel extends from a back frame of the carrier to a hinge portion of the telecommunication module and individual wires of the first wire bundle are insertable in the telecommunication module. The bundled wire guide, when installed as part of the carrier, provides one or more closed wire channels that mechanically protect the wire bundles. In addition, the bundled wire guide provides a mechanism to install wires through the back frame of the carrier without having to open or pivot the carrier/module assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.