Bonding method and bonded body
US8679283B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 26, 2012 |
| Grant date | Mar 25, 2014 |
| Priority date | — |
| Expiry date | Jun 26, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31663
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A bonding method of bonding two base members together through a bonding film is provided. The bonding method is a method for forming a bonded body in which a first base member and a second base member are bonded together through the bonding film. The bonding method includes: applying a liquid material containing a silicone material composed of silicone compounds onto a surface of at least one of the first and second base members to form a liquid coating on the surface; drying the liquid coating so that it is transformed into the bonding film on the surface of the at least one of the first and second base members; and applying energy to the bonding film so that a bonding property is developed in the vicinity of a surface thereof, to thereby bond the first and second base members together through the bonding film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.