Laser system and processing conditions for manufacturing bioabsorbable stents
US8679394B2 · kind B2 · utility
11Cited by
14References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 10, 2010 |
| Grant date | Mar 25, 2014 |
| Priority date | — |
| Expiry date | Dec 24, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/50
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention involves laser machining polymer substrates to form a stent with laser parameters that minimize damage to the substrate in a surface region adjacent to the machined edge surface. The wavelength and pulse width are selected for this unique application and they can be controlled to minimize the surface modifications (such as voids, cracks which are induced by the laser-material interaction) which contribute to the variation in mechanical properties with distance from the edge surface, bulk mechanical properties, or a combination thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.