Backgrind process for integrated circuit wafers
US8679945B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Mar 5, 2012 |
| Grant date | Mar 25, 2014 |
| Priority date | — |
| Expiry date | Mar 5, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit is formed by coating a top surface of a wafer that has been processed through all integrated circuit chip manufacturing steps prior to backgrind with photoresist, applying backgrind tape over a top surface of the photoresist, backgrinding a back surface of the wafer to a specified thickness, removing the backgrind tape from the top surface of the photoresist, and removing the photoresist. The surface of the integrated circuit and any devices that may be bonded to the surface of the integrated circuit are protected by the photoresist layer during removal of the backgrind tape.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.