Prevention and control of intermetallic alloy inclusions
US8679964B2 · kind B2 · utility
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7Claims
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Key dates
| Filing date | Jul 15, 2008 |
| Grant date | Mar 25, 2014 |
| Priority date | — |
| Expiry date | Sep 18, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3463
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In using Ni(P) and Sn-rich solders in Pb free interconnections, the prevention and control of the formation of intermetallic compound inclusions, can be achieved through a reaction preventive or control layer that is positioned on top of an electroless Ni(P) metallization, such as by application of a thin layer of Sn on the Ni(P) or through the application of a thin layer of Cu on the Ni(P).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.