Mitigating the effects of defects in high temperature semiconductor wires

US8680015B2 · kind B2 · utility

Assignee

• American Superconductor Corporation · US

Inventors

• Henry C. Valcour, III · Upton, US
• Peter D. Antaya · Sutton, US
• John Gannon · Shaker Heights, US
• Eric R. Podtburg · Natick, US
• Subramaniam Anandakugan · Acton, US
• William L. Carter · Chelmsford, US
• Hong Cai · Ayer, US
• Michael A. Tanner · Westborough, US
• David R. Crotzer · Nashua, US
• Alexander Otto · Chelmsford, US
• Dana Krause · Waltham, US

Key dates

• Filing date: Mar 8, 2012
• Grant date: Mar 25, 2014
• Expiry date: Jul 20, 2032

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10N60/80

Abstract

A method includes locating a defect in a first segment of high temperature superconducting wire. A second segment of high temperature superconducting wire is then positioned onto the first segment of high temperature superconducting wire such that the second segment of high temperature superconducting wire overlaps the defect. A path is then created such that current flows through the second segment of high temperature superconducting wire. The first segment of high temperature superconducting wire and second segment of high temperature superconducting wire are then laminated together.