Patent · US Active

Process for producing modified epoxy resin

US8680180B2 · kind B2 · utility

6Cited by
11References
3Claims
0Family size

Assignee

Inventors

Key dates

Filing dateFeb 13, 2012
Grant dateMar 25, 2014
Priority date
Expiry dateFeb 13, 2032

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH05K1/0373
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

An epoxy resin composition comprises an epoxy resin (A) and rubber-like polymer particles (B). The rubber-like polymer particles (B) maintain a finely dispersed state of primary particles. The content of the rubber-like polymer particles (B) is 0.5 to 80% by weight when the total amount of the epoxy resin (A) and rubber-like polymer particles (B) is 100% by weight. Rubber-like polymer particles (B) are obtainable by graft-polymerizing 5 to 50% by weight of a shell layer (B-2) with 50 to 95% by weight of a rubber particle core (B-1), and average particle diameter of the rubber-like polymer particles (B) is 0.03 to 2 μm. Rubber particle core (B-1) comprises elastic material of not less than 50% by weight of at least one monomer selected from diene monomers and (meth)acrylate monomers and less than 50% by weight of another coploymerizable vinyl monomer, or polysiloxane rubber elastic materials, or a mixture thereof.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.