Modular enclosure assembly for terminals wiring and distribution
US8680407B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 4, 2012 |
| Grant date | Mar 25, 2014 |
| Priority date | — |
| Expiry date | Oct 4, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K5/0217
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A modular enclosure assembly comprising: an upper and lower enclosure subassemblies, interconnected by a partial interpenetration, and a pair of hinged panel subassemblies for opening/closing the inner space of the enclosure subassemblies. Each of the enclosure subassemblies incorporates a back base plate having a first interpenetrating zone, located at an end of a lower left side of the back base plate, and a second interpenetrating zone, located at an end of a lower right side of the back base plate and juxtaposed with the first interpenetrating zone. The second interpenetrating zone incorporates a slat partially superposed on a rear surface of the back base plate where and with which this second interpenetrating zone forms a monoblock structure and from which the slat extends downwardly, beyond the rear surface of the back base plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.