Data transmission through optical vias
US8680458B2 · kind B2 · utility
1Cited by
19References
18Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 7, 2010 |
| Grant date | Mar 25, 2014 |
| Priority date | — |
| Expiry date | Oct 7, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10121
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Technologies generally described herein relate to multilayer circuit boards with optical vias for data transmission between the layers. One or more regions may be created on a multilayer circuit board for optical vias. A transparent conducting oxide (TCO) layer can be deposited on a top and/or bottom layer of the circuit board. P-N junctions can be created over the TCO layer about the one or more regions to form optical vias as photo-emitting and/or photo-detecting components. The photo-emitting and/or photo-detecting components may be coupled to electronic components on the multilayer circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.