Encapsulation, MEMS and encapsulation method
US8680665B2 · kind B2 · utility
1Cited by
2References
22Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 15, 2009 |
| Grant date | Mar 25, 2014 |
| Priority date | — |
| Expiry date | May 30, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1461
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method and encapsulation of a sensitive mechanical component structure in one embodiment includes a semiconductor substrate, and a film covering a component structure on the substrate, said film including at least one polymer layer, and at least one cavity formed between the component structure and the film, wherein at least one through contact penetrates through the film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.