Semiconductor package and method for fabricating the same
US8680685B2 · kind B2 · utility
6Cited by
5References
33Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 27, 2010 |
| Grant date | Mar 25, 2014 |
| Priority date | — |
| Expiry date | Oct 13, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package includes a semiconductor chip having a first bump group and a second bump group, and a package substrate having a first pattern for data communication with the semiconductor chip and a second pattern for supplying power to the semiconductor chip or grounding the semiconductor chip, wherein the first bump group is disposed on the first pattern and the second bump group is disposed on the second pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.