Heat dissipation unit for a wireless network device
US8681501B2 · kind B2 · utility
21Cited by
17References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 17, 2010 |
| Grant date | Mar 25, 2014 |
| Priority date | — |
| Expiry date | Jan 10, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
According to one embodiment of the invention, an apparatus comprises a heat dissipation unit, such as a heat sink, that encases wireless logic in order to completely surround such logic. When adapted as a wireless network device, a casing further encases the heat dissipation unit. The casing includes a plurality of slots that are aligned with heat-radiating elements positioned around the periphery of the heat dissipation unit to allow for cooling by convection.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.