Modular sub-flooring system
US8683769B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 5, 2010 |
| Grant date | Apr 1, 2014 |
| Priority date | — |
| Expiry date | Aug 11, 2030 |
Classification
- Technology area (CPC E)Fixed Constructions
- CPC primaryE04F2201/095
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
A modular sub-flooring system for supporting an overlayment above a ground surface includes a plurality of sub-floor tiles situated about a ground surface, with each sub-floor tile having a substantially-flat top surface that is adapted to receive and support an overlayment, and a connection interface with opposing engagement surfaces. The sub-flooring system also includes a plurality of removable bridge connectors, with each of the bridge connectors having a plurality of tile interfaces, and with each tile interface having complimentary engagement surfaces configured to engage with the opposing engagement surfaces of the connection interfaces. The tile interfaces of the bridge connectors couple to the respective connection interfaces of any adjacent sub-floor tiles to restrain the relative vertical movement between the adjacent sub-floor tiles while facilitating controlled relative lateral movement between the sub-floor tiles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.