Patent · US Active

Pressure relief valve

US8684034B2 · kind B2 · utility

1Cited by
5References
11Claims
0Family size

Assignee

Inventors

Key dates

Filing dateOct 19, 2009
Grant dateApr 1, 2014
Priority date
Expiry dateJul 29, 2030

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T137/87555
  • WIPO fieldMechanical elements
  • WIPO sectorMechanical engineering

Abstract

A micromechanical pressure relief valve arrangement comprises a stack of wafers. An active pressure relief valve is realized within the stack of wafers. A passive pressure relief valve is also realized within the stack of wafers, arranged in parallel to the active pressure relief valve. A check valve, also realized within the stack of wafers, is arranged in series with both the active pressure relief valve and the passive pressure relief valve.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.