Method for forming an aperture and actuator layer for an inkjet printhead
US8684499B2 · kind B2 · utility
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13References
11Claims
0Family size
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Key dates
| Filing date | Sep 24, 2010 |
| Grant date | Apr 1, 2014 |
| Priority date | — |
| Expiry date | Sep 20, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24322
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A method enables multiple inkjet printhead dies to be manufactured by bonding a single wafer to a single polymer layer. Multiple die sites on the single wafer are arranged in a predetermined pattern that corresponds to the pattern in which a plurality of aperture arrays are arranged in the polymer layer. The die sites on the wafer and the aperture arrays in polymer layer are aligned, the wafer and polymer layer are bonded, and the bonded wafer and polymer layer are cut to form a plurality of inkjet printhead dies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.