Optical frame attached with alignment features microfabricated in die
US8684612B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 1, 2011 |
| Grant date | Apr 1, 2014 |
| Priority date | — |
| Expiry date | May 7, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/43
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A photonic device assembly including a photonic device fabricated on a chip substrate, the chip substrate having a physical alignment feature fabricated therein, and a frame to couple an external optical lens or interconnect to the photonic device. The frame has a frame facet abutted to a complementary facet of the physical alignment feature. An adhesive permanently affixes the frame to the photonic device as aligned by the abutted facets. A method of forming a photonic device assembly includes microfabricating a physical alignment feature in a chip substrate of a photonic device and joining a frame to the chip substrate by abutting a facet of the coupling to a complementary facet of the fabricated physical alignment feature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.