Inflation sensor mount and method of assembly
US8684964B2 · kind B2 · utility
2Cited by
31References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 14, 2012 |
| Grant date | Apr 1, 2014 |
| Priority date | — |
| Expiry date | Jun 14, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49826
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
An inflation device comprising a housing configured to receive a sensor assembly is disclosed. In some embodiments, the sensor assembly may be coupled to the housing through use of a snap fit-type connection. Further, the working fluid of the inflation device may be in direct communication with the pressure sensor, without the use of secondary fluids such as gels.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.