Magnetic shunting pads for optimizing target erosion in sputtering processes
US8685214B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2011 |
| Grant date | Apr 1, 2014 |
| Priority date | — |
| Expiry date | Mar 7, 2032 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/35
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Magnetic flux shunting pads for optimizing target erosion in sputtering processes are provided. In one embodiment, the invention relates to a sputtering system for countering uneven wear of a sputter target, the system including a sputter target having an emitting surface and a rear surface opposite to the emitting surface, a moving magnet assembly positioned proximate the rear surface and including a planar base and a magnet fixed to the planar base at a preselected point, the moving magnet assembly configured to be moved such that a position of the magnet relative to the rear surface is varied, and a magnetic shunting pad having a planar shape and positioned between the moving magnet assembly and the target, wherein the shunting pad includes uneven magnetic shunting characteristics.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.