Surface coating for electronic systems
US8685529B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 16, 2012 |
| Grant date | Apr 1, 2014 |
| Priority date | — |
| Expiry date | Apr 16, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/268
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for coating for a substrate, comprising applying an underlayer of a self assembling monolayer well ordered array of long chain molecules on the substrate; and applying a top layer, over the underlayer, wherein the self-assembling monolayer well ordered array serves as a molecular template organizing formation of said top layer, comprising at least one of a thermally-resistant polymer layer over said self assembling monolayer selected from the group consisting of epoxies, and phosphorus-based polyimides; and a metal oxide, metal nitride, or a ceramic. The self assembling monolayer may be selectively applied to a portion of the substrate, leaving an uncoated region, and the top layer formed only over the areas of the substrate coated with the self-assembling monolayer, resulting in at least one region of the substrate which is not coated with the top layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.