High thermal conductivity materials aligned within resins
US8685534B2 · kind B2 · utility
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95References
20Claims
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Inventors
Key dates
| Filing date | Jan 13, 2012 |
| Grant date | Apr 1, 2014 |
| Priority date | — |
| Expiry date | Sep 8, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/25
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
In one embodiment the present invention provides for a high thermal conductivity resin that comprises a host resin matrix 32 a high thermal conductivity filler 30. The high thermal conductivity filler forms a continuous organic-inorganic composite with the host resin matrix, and the fillers have an aspect ratio of between 3-100. The fillers are substantially evenly distributed through the host resin matrix, and are aligned in essentially the same direction. In some embodiments the resins are highly structured resin types.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.