Patent · US Active

Method for optimizing wafer edge patterning

US8685633B2 · kind B2 · utility

0Cited by

3References

1Claims

0Family size

Assignee

LSI · US

Inventors

Duane B. Barber · Portland, US
David J. Sturtevant · Caro, US

Key dates

Filing date	Aug 30, 2004
Grant date	Apr 1, 2014
Priority date	—
Expiry date	Jul 16, 2027

Classification

Technology area (CPC G)Physics
CPC primaryG03F7/70425
WIPO fieldOptics
WIPO sectorInstruments

Abstract

A method of printing an image on a wafer. The method includes the steps of printing a main image, wherein the main image includes fields which are fully on the wafer, and printing an alternate image, wherein the alternate image includes fields which are only partially on the wafer. The alternate image could be placed on a separate mask which is loaded onto the exposure tool after the mask with the main image has completed printing. Alternatively, it could be an extra image specially inserted on the mask with the main image for that layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.