Microelectronic assembly including built-in thermoelectric cooler and method of fabricating same
US8686277B2 · kind B2 · utility
4Cited by
8References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 27, 2004 |
| Grant date | Apr 1, 2014 |
| Priority date | — |
| Expiry date | Sep 9, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for fabricating a microelectronic assembly including a built-in TEC, a microelectronic assembly including a built-in TEC, and a system including the microelectronic assembly. The method includes providing a microelectronic device, and fabricating the TEC directly onto the microelectronic device such that there is no mounting material between the TEC and the microelectronic device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.